Soft epoxy adhesive

[Formula]: (mass)

Linoleic acid dimerized epoxy resin glyceride 100

1,6-Hexanediamine 35

Polypropylene glycol epoxy glyceryl ether 180

Polyoxypropylene triol 25

Silica 25.9

Aluminum oxide powder 635

[Preparation Method]: After mixing the three prepolymers, add silica and alumina powder, then add hexamethylenediamine, stir to obtain a soft epoxy adhesive

【Usage】: After sizing, it is cured at 93°C. The shear strength after curing is 689 to 3445 KPa. Used for bonding between electronic components and circuit boards.

Source: 21st Century Fine Chemicals Network