Photosensitive resist ink application in LCD graphic manufacturing (2)

6, development

6.1 Developed composition: 0.8%~1.2% sodium carbonate solution.

6.2 The development process: During the development, the unexposed ink appears swollen in the developer first. After the swelling is completed, the pattern appears off. At this time, the developing process can be completed by rinsing clean under running water. However, as time goes on, the concentration of the developer will change, and when development is difficult, the development time may be appropriately increased and a new liquid may be replaced as appropriate.

6.3 Determination of development points:

1) Developing point: When the exposed plate enters the developing area of ​​the developing machine, the point where the unexposed ink starts to fall off (the position at the length of the developing area) is the developing point.

2) Determination of the development point: It is related to the development temperature of the developer and the nozzle pressure.

3) General image spots are all set at 3/4 of the development area (ie 75% of the area of ​​the plate area that has to be developed has passed through the shadow area, and 25% of the distance is the total surface area that will be displayed.) No residue film).

4) Washing: Wash excess film and excess developer to ensure the clarity of the graphics and the underlying layer.

6.4 Control the relationship between developer pressure, temperature, conveying speed, and developer concentration

7, after curing:

In order to make up for the lack of exposure and to strengthen the bonding force between the ink and the bottom layer, the plate can be reheated and the cross-linking and curing can be strengthened according to actual production needs. It can be kept in a 100-degree heating oven for 15-30 minutes, or with a far infrared drying tunnel.

8, etching:

L-P2106 photosensitive resist has good etching resistance. It not only resists copper chloride etching under certain conditions, but also resists many acidic etching solutions. Such as ferric chloride series, sulfuric acid hydrogen peroxide series, nitric acid series etching liquid.

8.1 Static Etching: Static etching involves immersing the ITO plate to be etched into a static etchant to perform a substitution reaction. After a period of time, the pattern is etched. This type of operation is simple and no special equipment is required. However, it should be noted that the etching time is such that the complete ITO pattern is obtained after the etching solution has reacted with the bottom layer of ITO. If the time is too long, there will be an over-etching phenomenon that will make the lines thinner and change the geometry inside the figure.

8.2 Moving etching: It is through the movement of the etching liquid that the etching liquid of the surface to be etched is quickly and cyclically changed, prompting the reaction to speed up and making the pattern more faithful. At present, the general dynamic etching adopts the spray type etching machine. Although it is necessary to add special equipment, after adjusting the nozzle and etching speed, it is particularly suitable for continuous production of large quantities. It should be noted that during the operation, the ITO surface should face down, and the etching liquid can be quickly exchanged vertically to ensure the accuracy of etching pattern dimensions and etching quality.

8.3 Deinking: The deinking condition should be carried out in a solution of 55-60, 5% NaOH. The ink layer should be flaky off within 80 seconds.

9, washed:

This is a very important process. The washing method should be three-stage washing.

Namely: ... circulating washing → city washing → pure water washing (conditions should be online drying)

10. Summary:

Because L-P2106 photosensitive resist ink has excellent resolution and good corrosion resistance. Can complete the LCD in the ITO of the precision graphics, and the low price so it is favored by the industry. I believe in the future there will be wider promotion and use in this industry.

Source: Coatings Technology Information Network